Tin stripper nickel
The corresponding copper attack was low. I would strongly suggest that you do [not] mess with concentrated nitric and the hazardous waste you will produce once you load it with nickel. In recent years, more and more captive plating facilities have been investigating the use of electrolytic stripping processes to minimize disposal cost. In the printed wiring board industry, the substrate undergoes processing prior to application of nickel in the ENIG process. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.
Cufix-E Copper Stripper
Stripping of Plated Finishes
Electrolytic stripping is not able to easily handle complex geometries due to high- and low-current-density areas or parts that have to be barrel processed. Furthermore, Electrowinning also returns the metal in a form that is reasonably pure, and thus readily accepted by refiners. In situations where mineral acids can be employed for removing metallic deposits, it is generally recognized that the controlled addition of small amounts of fluorides, chlorides, bromides or organic acids will help accelerate and prolong the stripping action. This process is also available in a lead-free white version — the most commonly used variation plated in North America. For those fabricators who make extensive use of tin, and who thus require only a tin stripper, this high cost is a distinct disadvantage. The result typically is a high cost formulation.
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Electroless gold, Miralloy, Tin Nickel Plating, Electrolytic Palladium
It is available in rack or barrel versions. I would strongly suggest that you do [not] mess with concentrated nitric and the hazardous waste you will produce once you load it with nickel. How can I strip nickel layer over zinc die cast base metal? The foregoing ranges are given with reference to the inorganic nitrate per se, but it generally will be the case that the most readily available commercial form for some of the inorganic nitrates for use in making up the aqueous solution will be as a solution thereof e. In the most preferred embodiment of the invention, both nitric acid and inorganic nitrate most preferably, ferric nitrate will be present in the solution, and there additionally will be present an inhibitor for minimizing attack of the underlying copper metal surface. They have fewer variables to be controlled and are less expensive to set up than their electrolytic counterparts.
Attack of underlying copper was very low, on the order of about 10 microinches per minute. During the micro-etching the wiring board or other substrate is contacted with standard etching solution. Once the copper concentration and lead, if applicable is depleted, electrowinning is continued until the tin recovery rate reaches a practical minimum. The Ronastan TP-SR electroplating process is specifically formulated for use in high-speed continuous steel strip tin plating operations. A surface on which nickel can be deposited is contemplated for use herein. A composition according to claim 10 wherein said aqueous solution consists essentially of sulfuric acid, nitric acid and said inhibitor. An alternative pH range is about 2.